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Taoyuan, Taiwan, 8^th. Sep— Ablecom Technology Inc., a leading provider of professional server chassis and advanced thermal solutions, today announced the launch of its next-generation Rear Chiller Door, an energy-efficient rack-level cooling solution engineered for high-density and high-performance computing (HPC), AI training clusters, cloud computing, and 5G applications. Designed to address the growing thermal challenges in modern data centers, the solution delivers outstanding cooling performance while significantly reducing energy consumption.

The new Rear Chiller Door supports up to 75kW of heat dissipation per rack, using a high-efficiency liquid cooling system to directly remove exhaust heat at the rear of the rack. This approach reduces overall room temperature, achieving 30–50% total energy savings and 20–30% fan power reduction, while dramatically lowering Power Usage Effectiveness (PUE) and optimizing operating costs. By removing heat at the rack level, the solution eliminates the need for traditional hot aisle/cold aisle isolation, simplifying data center design and reducing infrastructure investments.

Featuring a modular, plug-and-play design, the Rear Chiller Door integrates multi-point temperature and flow sensors for seamless compatibility with Data Center Infrastructure Management (DCIM) systems, enabling intelligent operations and real-time monitoring.

Committed to energy efficiency, carbon reduction, and sustainability, Ablecom has designed the Rear Chiller Door to meet international energy standards and support customers in achieving net-zero carbon goals. The solution is ideal for both new builds and retrofit projects, helping data centers scale efficiently for next-generation workloads.

About Ablecom

Founded in 1997, Ablecom Technology Inc. is a leading provider of server chassis, thermal solutions, and industrial computing platforms, serving customers across North America, Europe, and Asia with high-performance, reliable products and services.