ABLECOM大訊集團

PRODUCT

PRODUCT

Category

3.5" SBC Fanless Chassis

Features
  1. Support 3.5” SBC motherboard, up to 15W CPU-TDP
  2. High-performance thermal solution
  3. Supports Wall-mount bracket
  4. Multi-extended I/O Connectors
  5. For SOHO, SMB Office application

Model No.

CS-915

M/B Form Factor

3.5” SBC (146 x 102mm/5.75”x4.02”)

Dimension (WxDxH)

196mm x 151mm x 44.34mm (7.72” x 5.94” x 1.75”)

Color

Black

Processor Support

TDP<15W (Depends on CPU Heatsink)

Drive Bay

N/A (support M.2 Module or SATA-DOM Type)

Peripheral Bay

-

Backplane

-

Expansion Slot

-

System Cooling

Customized Thermal Block Solution

Front Panel

1 x Power Button

1 x Power LED

1 x HDD Activity LED

2 x Reserved Wifi Antenna Hole

1 x Reserved Panel for Motherboard I/O

Back Panel

1 x DC Jack

1 x DIO Port (DB9 Type)

4 x USB2.0 or USB3.0 (Optional)

4 x COM Ports

2 x Audio Jacks (MIC/SPK)

Power Supply

60W/ 12V External Power Adaptor

Environment

Operating Temperature: 10° ~ 40°C (50° ~ 104°F)

Storage Temperature: -40° ~ 80°C (-40° ~ 176°F)

Operating Humidity: 5% ~ 85% RH (non-condensing)

Storage Humidity: 5% ~ 95% RH (non-condensing)

Optional

Category

Model No.

Description

Heatsink

ACL-S10010

1U Active Heatsink, LGA115X, AL fin+Cu plate

 

AHS-S10050

1U Passive Heatsink, LGA2011, Narrow

 

AHS-S10051

1U Passive Heatsink, LGA2011, Narrow

 

AHS-S10061

1U Passive Heatsink, LGA2011, Square

 

AHS-S10070

1U Passive Heatsink, LGA115X, AL fin+Cu plate

 

AHS-S10080

1U Passive Heatsink, LGA4094, AMD, TDP=135W

 

AHS-S10120

1U Passive Heatsink, LGA2011, Narrow

 

AHS-S10130

1U Passive Heatsink, LGA2011, Square

 

AHS-S10200

1U Passive Heatsink, LGA3647

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